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WP2 – Photonic Integration

In work package 2 we will explore the integration of photonic device elements with silicon for applications in communication, sensing and power generation.

The topics include:

  • Development of epitaxy, material characterization and single pixel elements for infrared detector arrays
  • Design and fabrication of CMOS-based read-out circuitry for focal plane arrays
  • Using Nanowire-based photovoltaics for on-chip power generation in IoT modules
  • Epitaxy and fabrication technologies for CMOS-photonics heterogenous integration including interfacing with waveguides and electronics
  • Fabrication of complete CMOS-photonic integrated circuit